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Printed Circuit Board News / Multimedia


Industry Veteran Kurt Palmer Joins Burkle North America

January 2019: Helfried Weinzerl, president and CEO of Burkle North America, announced today that industry veteran Kurt Palmer has joined Burkle North America as vice president of Burkle’s North American Electronic Product Group. Watch the Real Time with... IPC APEX EXPO 2019 video interview conducted by Pete Starkey of I-Connect007 with Kurt and out-going VP Dave Howard here.

Printed Circuits Installs Burkle High-Temp Lamination Press

January 2019: (Source: Printed Circuits)
Flex and rigid-flex circuit board manufacturer Printed Circuits has purchased and installed a new Burkle high-temperature vacuum lamination press. The new press is heated and cooled with oil. Added to their existing line, the new press offers vacuum lamination temperatures up to 625ºF.

Burkle North America Exhibits at IPC APEX EXPO 2017

Dick Crowe reports on the first day at the IPC APEX EXPO show in San Diego, CA.

APCT Engineering Announces New Equipment

February 2016: Steve Robinson, President / CEO of APCT announced that in January, 2016, his company has released to full production new equipment sets including a Schmoll Combo Drill CO2/UV Laser Drilling System.

Schmoll Introduces New MDI Product at productronica 2015

November 2015: On display at productronica 2015, Schmoll Maschinen was demonstrating their economical, expandable MDI line. A new direct imaging concept that transfers UV light images to the PCB substrate using high resolution micromirror chips, the MDI Series offers an efficient, precision German-made, flexible solution for resist and solder mask applications.