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New Generation Module Implanting and Cavity Milling System

May 05, 2016 at 1:08 PM

Ruhlamat, a leader in Cavity Milling and Chip Module Implanting Equipment introduces their new PowerCombi DI (Dual Interface) production system.

The new in-line production system has significant features for Card Fabricators. From Pocket Milling, conductive glue dispensing and Chip Implanting the PowerCombi DI line and process has been recognized by the German Institute FOGRA as providing a card having a lifetime guarantee of 10 years and is therefore unique in the market.

Features of the PowerCombi DI include high volume of up to 2500 pieces per hour. Fast curing conductive glue allows immediate distribution of the card without a delaying 24-hour holding time required by other systems. Less Work in Process (WIP) and high through put positions the Ruhlamat PowerCombi DI system as the premiere standard in the industry.

For other information regarding Ruhlamat, or Bürkle’s complete line of card body fabrication equipment contact Dave Howard or Ed Strahota at 714-379-5090